
Somos Ledo 6060 is a photo sensitive resin material with tough texture and excellent waterproof performance developed by DSM which can be used to make precision parts for prototyping and functional testing.
Technology: SLA
Build time: 24 - 48 hours
Tolerance: ±0.2mm or within 0.3%
Wall thickness: 0.8mm
Maximum size: 780*780*530mm
Heat deflection temp: 56℃
Characteristics: High dimensional stability, good temperature resistance, small-batch parts.
Weaknesses: NOT suitable for outdoors, high temperatures, sunlight and UV light environments.
Applications: Waterproof models, functional prototypes in automotive, medical, consumer electronics fields.
| Measurement | Test Method | Value |
|---|---|---|
| Heat deflection temperature | ASTM D648 @ 0.46 MPa (66 psi) | 56℃ |
| Flexural modulus | ASTM D790M | 2,400MPa |
| Impact strength notched Izod | ASTM D256A | 45J/m |
| Tensile modulus | ASTM D638M | 2,450MPa |
| Tensile strength | ASTM D638M | 50MPa |
| Elongation at break | ASTM D638M | 10% |